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jfet input operational amplifiers nc v cc output offset null d suffix plastic package case 751 (so8) p suffix plastic package case 626 p suffix plastic package case 646 mc34001 (top view) pin connections pin connections mc34002 (top view) offset null noninv. input v ee inv. input v ee inputs a inputs b output b output a v cc inputs 1 output 1 v cc inputs 2 output 2 output 4 inputs 4 v ee inputs 3 output 3 mc34004 (top view) 4 23 1 1 2 3 4 8 7 6 5 + + + 1 2 3 4 8 7 6 5 1 2 3 4 5 6 78 9 10 11 12 13 14 + + + + 1 8 1 8 14 1 2265 motorola analog ic device data these low cost jfet input operational amplifiers combine two stateoftheart analog technologies on a single monolithic integrated circuit. each internally compensated operational amplifier has well matched high voltage jfet input devices for low input offset voltage. the bifet technology provides wide bandwidths and fast slew rates with low input bias currents, input offset currents, and supply currents. the motorola bifet family offers single, dual and quad operational amplifiers which are pincompatible with the industry standard mc1741, mc1458, and the mc3403/lm324 bipolar devices. the mc34001/ 34002/34004 series are specified from 0 to +70 c. ? input offset voltage options of 5.0 mv and 10 mv maximum ? low input bias current: 40 pa ? low input offset current: 10 pa ? wide gain bandwidth: 4.0 mhz ? high slew rate: 13 v/ m s ? low supply current: 1.4 ma per amplifier ? high input impedance: 10 12 w ? high common mode and supply voltage rejection ratios: 100 db ? industry standard pinouts ordering information op amp function device operating temperature range package single mc34001bd, d t a =0 to+ 70 5 c so8 single mc34001bp, p t a = 0 ?? ? c plastic dip dual mc34002bd, d t a =0 to +70 5 c so8 dual mc34002bp, p t a = 0 ?? ? c plastic dip quad mc34004bp, p t a = 0 to +70 c plastic dip
mc34001, b mc34002, b mc34004, b 2266 motorola analog ic device data maximum ratings rating symbol value unit supply voltage v cc , v ee 18 v differential input voltage (note 1) v id 30 v input voltage range v idr 16 v open short circuit duration t sc continuous operating ambient temperature range t a 0 to +70 c operating junction temperature t j 150 c storage temperature range t stg 65 to +150 c notes: 1. unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply. electrical characteristics (v cc = +15 v, v ee = 15 v, t a = 25 c, unless otherwise noted.) characteristics symbol min typ max unit input offset voltage (r s 10 k) mc3400xb mc3400x v io e e 3.0 5.0 5.0 10 mv average temperature coefficient of input offset voltage r s 10 k, t a = t low to t high (note 2) d v io / d t e 10 e m v/ c input offset current (v cm = 0) (note 3) mc3400xb mc3400x i io e e 25 25 100 100 pa input bias current (v cm = 0) (note 3) mc3400xb mc3400x i ib e e 50 50 200 200 pa input resistance r i e 10 12 e w common mode input voltage range v icr 11 e +15 12 e e v large signal voltage gain (v o = 10 v, r l = 2.0 k) mc3400xb mc3400x a vol 50 25 150 100 e e v/mv output voltage swing (r l 10 k) (r l 2.0 k) v o 12 10 14 13 e e v common mode rejection ratio (r s 10 k) mc3400xb mc3400x cmrr 80 70 100 100 e e db supply voltage rejection ratio (r s 10 k) (note 4) mc3400xb mc3400x psrr 80 70 100 100 e e db supply current (each amplifier) mc3400xb mc3400x i d e e 1.4 1.4 2.5 2.7 ma slew rate (a v = 1.0) sr e 13 e v/ m s gainbandwidth product gbw e 4.0 e mhz equivalent input noise voltage (r s = 100 w , f = 1000 hz) e n e 25 e nv/ hz equivalent input noise current (f = 1000 hz) i n e 0.01 e pa/ hz notes: 2. t low =0 c for mc34001/34001b t high = +70 c for mc34001/34001b 0 c for mc34002 +70 c for mc34002 0 c for mc34004/34004b +70 c for mc34004/34004b 3. the input bias currents approximately double for every 10 c rise in junction temperature, t j . due to limited test time, the input bias currents are correlated to junction temperature. use of a heatsink is recommended if input bias current is to be kept to a minimum. 4. supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously, in accordance with common practice.
mc34001, b mc34002, b mc34004, b 2267 motorola analog ic device data electrical characteristics (v cc = +15 v, v ee = 15 v, t a = t low to t high [note 2].) characteristics symbol min typ max unit input offset voltage (r s 10 k) mc3400xb mc3400x v io e e e e 7.0 13 mv input offset current (v cm = 0) (note 3) mc3400xb mc3400x i io e e e e 4.0 4.0 na input bias current (v cm = 0) (note 3) mc3400xb mc3400x i ib e e e e 8.0 8.0 na common mode input voltage range v icr 11 e e v large signal (v o = 10 v, r l = 2.0 k) mc3400xb mc3400x a vol 25 15 e e e e v/mv output voltage swing (r 10 k) (r 2.0 k) v o 12 10 e e e e v common mode rejection ratio (r s 10 k) mc3400xb mc3400x cmrr 80 70 e e e e db supply voltage rejection ratio (r s 10 k) (note 4) mc3400xb mc3400x psrr 80 70 e e e e db supply current (each amplifier) mc3400xb mc3400x i d e e e e 2.8 3.0 ma notes: 2. t low =0 c for mc34001/34001b t high = +70 c for mc34001/34001b 0 c for mc34002 +70 c for mc34002 0 c for mc34004/34004b +70 c for mc34004/34004b 3. the input bias currents approximately double for every 10 c rise in junction temperature, t j . due to limited test time, the input bias currents are correlated to junction temperature. use of a heatsink is recommended if input bias current is to be kept to a minimum. 4. supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously, in accordance with common practice.
mc34001, b mc34002, b mc34004, b 2268 motorola analog ic device data v cc /v ee = 15 v r l = 10 k r l = 2.0 k v cc /v ee = 15 v 5.0 v 10 v r l = 2.0 k t a = 25 c v o , output voltage swing (v pp ) v o , output volt a ge swin g (v pp )v o , output volt a ge swin g (v pp ) figure 1. input bias current versus temperature figure 2. output voltage swing versus frequency figure 3. output voltage swing versus load resistance figure 4. output voltage swing versus supply voltage figure 5. output voltage swing versus temperature figure 6. supply current per amplifier versus temperature t a , ambient temperature ( c) 75 50 25 0 25 50 75 100 125 v cc /v ee = 15 v 100 1.0 k 10 k 100 k 1.0 m 10 m f, frequency (hz) r l , load resistance (k w ) 0.1 0.2 0.4 0.7 1.0 2.0 10 4.0 7.0 v cc /v ee = 15 v t a = 25 c v cc /v ee , supply voltage (v) 0 5.0 10 15 20 r l = 2.0 k t a = 25 c t a , ambient temperature ( c) 50 25 0 25 50 75 100 125 t a , ambient temperature ( c) 50 25 0 25 50 75 100 125 v cc /v ee = 15 v i , supply drain current (ma) d 100 10 1.0 0.1 0.01 30 25 20 15 10 5.0 0 30 20 10 5.0 0 40 30 20 10 0 35 30 25 20 15 10 5.0 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 40 35 , v o output voltage swing (v pp ) i ib , in put bias curre n t ( na )
mc34001, b mc34002, b mc34004, b 2269 motorola analog ic device data figure 7. largesignal voltage gain and phase shift versus frequency figure 8. largesignal voltage gain versus temperature figure 9. normalized slew rate versus temperature figure 10. equivalent input noise voltage versus frequency figure 11. total harmonic distortion versus frequency f, frequency (hz) phase shift (degrees) 1.0 10 100 1.0 k 10 k 100 k 1.0 m 1.0 m 10 m a vol gain phase shift v cc /v ee = 15 v r l = 2.0 k t a = 25 c a , voltage gain (v/mv) vol v cc /v ee = 15 v v o = 10 v r l = 2.0 k t a , ambient temperature ( c) 50 25 0 25 50 75 100 125 t a , ambient temperature ( c) normalized slew rate 50 25 0 25 50 75 100 125 f, frequency (khz) e 0.01 0.05 0.1 0.5 1.0 5.0 10 50 100 n v cc /v ee = 15 v a v = 10 r s = 100 w t a = 25 c v cc /v ee = 15 vdc a v = 1.0 v o = 6.0 v (rms) t a = 25 c f, frequency (khz) thd, total harmonic distortion (%) 0.1 0.5 1.0 5.0 10 50 100 nv/ hz ) , openloop gain , equivalent input noise voltage ( 10 6 10 5 10 4 10 3 10 1 10 2 1 1000 100 10 1.0 1.15 1.10 1.05 1.00 0.95 0.90 0.85 60 50 40 30 20 10 0 1.0 0.5 0.1 0.05 0.01 0.005 0.001 0 45 90 135 180
mc34001, b mc34002, b mc34004, b 2270 motorola analog ic device data figure 12. output current to voltage transformation for a dtoa converter representative circuit schematic (each amplifier) + inputs q3 q4 q5 q2 q1 v cc q6 j1 j2 q17 q20 q23 24 j3 2.0 k q14 q15 10 pf q19 q21 q22 q24 q9 q8 q7 q25 q12 q10 q13 q11 q16 q18 1.5 k v ee bias circuitry common to all amplifiers offset null (mc34001 only) output 1.5 k v cc r1 v ref r2 v cc = 15 v v o 1 + mc34001 v ee r o 15 pf dtoa a1 a2 a3 a4 a5 a6 a7 a8 lsb c v ee = 15 v msb settling time to within 1/2 lsb is approximately 4.0 m s from the time all bits are switched (c = 68 pf). the value of c may be selected to minimize overshoot and ringing. theoretical v o v o = v ref r1 (r o ) a1 a2 a3 a4 a5 a6 a7 a8 2 4 8 16 32 64 128 256 ++++ ++ + i o
mc34001, b mc34002, b mc34004, b 2271 motorola analog ic device data figure 13. positive peak detector figure 14. long interval rc timer figure 15. isolating large capacitive loads figure 16. wide bw, low noise, low drift amplifier 10 v 10 v c2 r2 r1 c1 3 4 v ee v in v cc 6 2 7 f max 240 khz power bw: f max = s r 2 p vp 240 khz parasitic input capacitance (c1 3.0 pf plus any additional layout capacitance) interacts with feedback elements and creates undesirable highfrequency pole. to compensate add c2 such that: r2c2 r1c1. 8 0.5 0.02 c l = r2 5.1 k v o v cc r1 5.1 k 2 7 6 4 3 mc34001 v ee r l 5.1 k c l 0.5 m f c c r3 10 +2.0 v 0 d v o i o v/ m s = 0.04 v/ m s (with c l shown) d t + overshoot 10% t s = 10 m s when driving large c l , the v o slew rate is determined by c l and i o(max) : = 2.0 v i o 8 v cc d1 2 3 + 6 5 + 7 reset v in 4 v ee 1/2 mc34002 1n914 1 m f * reset network or relay *polycarbonate capacitor d1 = hispeed, lowreverse leakage diode v o mc34001 v r run r4 r1 v1 r3 2 7 +15 v mc34001 6 r6 15 v clear c* r5 3 + 4 *polycarbonate or polystyrene capacitor time (t) = r4 cn (v r /v r v i ), r 3 = r 4 , r 5 = 0.1 r 6 if r1 = r2: t = 0.693 r4c design example: 100 second timer v r = 10 v c = l.0 m f r3 = r4 = 144 m r6 = 20 k r5 = 2.0 k r1 = r2 = 1.0 k r2 20 pf 1/2 mc34002
121 motorola analog ic device data tape and reel options in brief . . . page tape and reel configurations 122 . . . . . . . . . . . . . . . . . . . . . tape and reel information table 124 . . . . . . . . . . . . . . . . . . . analog mpq table 125 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . motorola offers the convenience of tape and reel packaging for our growing family of standard integrated circuit products. reels are available to support the requirements of both first and second generation pickandplace equipment. the packaging fully conforms to the latest eia481a specification. the antistatic embossed tape provides a secure cavity, sealed with a peelback cover tape.
122 motorola analog ic device data tape and reel configurations typical user direction of feed soic and micro8 devices pin 1 typical user direction of feed plcc devices typical user direction of feed dpak and d 2 pak devices mechanical polarization typical user direction of feed sot23 (5 pin) devices typical sot89 (3 pin) devices user direction of feed typical sot89 (5 pin) devices user direction of feed
123 motorola analog ic device data tape and reel configurations (continued) style a (preferred) to92 reel styles carrier strip adhesive tape rounded side feed rounded side of transistor and adhesive tape visible. flat side of transistor and adhesive tape visible. feed adhesive tape on top side carrier strip adhesive tape on top side style m ammo pack is equivalent to style e of reel pack dependent on feed orientation from box. flat side label style m style p (preferred) rounded side style p ammo pack is equivalent to styles a and b of reel pack dependent on feed orientation from box. flat side of transistor and adhesive tape visible. rounded side of transistor and adhesive tape visible. to92 ammo pack styles carrier strip adhesive tape flat side label carrier strip style e feed feed h2a h2a h f1 f2 p2 p2 p1 p d w w1 l1 w2 h2b h2b t1 t t2 h4 h5 h1 l to92 eia radial tape in fan fold box or on reel
124 motorola analog ic device data tape and reel information table tape width devices (1) reel size device package p (mm) per reel (inch) suffix so8, sop8 12 2,500 13 r2 so14 16 2,500 13 r2 so16 16 2,500 13 r2 so16l, so8+8l wide 16 1,000 13 r2 so20l wide 24 1,000 13 r2 so24l wide 24 1,000 13 r2 so28l wide 24 1,000 13 r2 so28l wide 32 1,000 13 r3 micro8 12 2,500 13 r2 plcc20 16 1,000 13 r2 plcc28 24 500 13 r2 plcc44 32 500 13 r2 plcc52 32 500 13 r2 plcc68 44 250 13 r2 plcc84 44 250 13 r2 to226aa (to92) (2) 18 2,000 13 ra, re, rp, or rm (ammo pack) only dpak 16 2,500 13 rk d 2 pak 24 800 13 r4 sot23 (5 pin) 8 3,000 7 tr sot89 (3/5 pin) 12 1,000 7 t1 (1) minimum order quantity is 1 reel. distributors/oem customers may break lots or reels at their option, however broken reels may not be returned. (2) integrated circuits in to226aa packages are available in styes a and e only, with optional aammo packo (suffix rp or rm). the ra and rp configurations are preferred. for ordering information please contact your local motorola semiconductor sales office.
125 motorola analog ic device data analog mpq table tape/reel and ammo pack package type package code mpq package type package code mpq plcc case 775 0802 1000/reel case 776 0804 500/reel case 777 0801 500/reel soic case 751 0095 2500/reel case 751a 0096 2500/reel case 751b 0097 2500/reel case 751g 2003 1000/reel case 751d 2005 1000/reel case 751e 2008 1000/reel case 751f 2009 1000/reel micro8 case 846a 2500/reel to92 case 29 0031 2000/reel case 29 0031 2000/ammo pack dpak case 369a 2500/reel d 2 pak case 936 800/reel sot23 (5 pin) case 1212 3000/reel sot89 (3 pin) case 1213 1000/reel sot89 (5 pin) case 1214 1000/reel
126 motorola analog ic device data
131 motorola analog ic device data packaging information in brief . . . the packaging availability for each device type is indicated on the individual data sheets and the selector guide. all of the outline dimensions for the packages are given in this section. the maximum power consumption an integrated circuit can tolerate at a given operating ambient temperature can be found from the equation: t j(max) t a r q ja(typ) p d(ta) = where: p d(ta) = power dissipation allowable at a given operating ambient temperature. this must be greater than the sum of the products of the supply voltages and supply currents at the worst case operating condition. t j(max) = maximum operating junction temperature as listed in the maximum ratings section. see individual data sheets for t j(max) information. t a = maximum desired operating ambient temperature r q ja(typ) = typical thermal resistance junction-to- ambient
132 motorola analog ic device data case outline dimensions lp, p, z suffix case 29-04 plastic package (to-226aa/to-92) issue ad kc, t suffix case 221a-06 plastic package issue y notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. dimension f applies between p and l. dimension d and j apply between l and k minimum. lead dimension is uncontrolled in p and beyond dimension k minimum. dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.022 0.41 0.55 f 0.016 0.019 0.41 0.48 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.04 2.66 p 0.100 2.54 r 0.115 2.93 v 0.135 3.43 r a p j l f b k g h section xx c v d n n xx seating plane 1 1 2 3 1 2 3 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. a k l g d n h q f 123 4 t seating plane s r j u t c 3 pl b y m b m 0.25 (0.010) y dim min max min max millimeters inches a 0.560 0.625 14.23 15.87 b 0.380 0.420 9.66 10.66 c 0.140 0.190 3.56 4.82 d 0.020 0.045 0.51 1.14 f 0.139 0.155 3.53 3.93 g 0.100 bsc 2.54 bsc h 0.280 7.11 j 0.012 0.045 0.31 1.14 k 0.500 0.580 12.70 14.73 l 0.045 0.070 1.15 1.77 n 0.200 bsc 5.08 bsc q 0.100 0.135 2.54 3.42 r 0.080 0.115 2.04 2.92 s 0.020 0.055 0.51 1.39 t 0.235 0.255 5.97 6.47 u 0.000 0.050 0.00 1.27
133 motorola analog ic device data t suffix case 314c01 plastic package issue a th suffix case 314a-03 plastic package issue d t, tv suffix case 314b-05 plastic package issue j 1 5 1 5 1 5 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim a min max min max millimeters 0.572 0.613 14.529 15.570 inches b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.570 0.585 14.478 14.859 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.381 0.635 k 0.730 0.745 18.542 18.923 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 s 0.210 0.260 5.334 6.604 u 0.468 0.505 11.888 12.827 t seating plane l s e c f k j optional chamfer 5x d 5x m p m 0.014 (0.356) t g a u b q p notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum. a k b q 5 pl d g j c m q m 0.356 (0.014) t l e t seating plane 12345 dim min max min max millimeters inches a 0.610 0.625 15.59 15.88 b 0.380 0.420 9.65 10.67 c 0.160 0.190 4.06 4.83 d 0.020 0.040 0.51 1.02 e 0.035 0.055 0.89 1.40 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.38 0.64 k 0.500 12.70 l 0.355 0.370 9.02 9.40 q 0.139 0.147 3.53 3.73 v q k f u a b g p m 0.10 (0.254) p m t 5x j m 0.24 (0.610) t optional chamfer s l w e c h n t seating plane notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.850 0.935 21.590 23.749 g 0.067 bsc 1.702 bsc h 0.166 bsc 4.216 bsc j 0.015 0.025 0.381 0.635 k 0.900 1.100 22.860 27.940 l 0.320 0.365 8.128 9.271 n 0.320 bsc 8.128 bsc q 0.140 0.153 3.556 3.886 s 0.620 15.748 u 0.468 0.505 11.888 12.827 v 0.735 18.669 w 0.090 0.110 2.286 2.794 5x d
134 motorola analog ic device data dt-1 suffix case 369-07 plastic package (dpak) issue k t, t1 suffix case 314d-03 plastic package issue d 2 3 4 1 2 3 1 4 5 dt suffix case 369a-13 plastic package (dpak) issue y 4 3 1 d a k b r v s f l g 2 pl m 0.13 (0.005) t e c u j h t seating plane z dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.180 bsc 4.58 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.102 0.114 2.60 2.89 l 0.090 bsc 2.29 bsc r 0.175 0.215 4.45 5.46 s 0.020 0.050 0.51 1.27 u 0.020 0.51 v 0.030 0.050 0.77 1.27 z 0.138 3.51 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 v s a k t seating plane r b f g d 3 pl m 0.13 (0.005) t c e j h dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.090 bsc 2.29 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.350 0.380 8.89 9.65 r 0.175 0.215 4.45 5.46 s 0.050 0.090 1.27 2.28 v 0.030 0.050 0.77 1.27 q 12345 u k d g s a b 5 pl j h l e c m q m 0.356 (0.014) t seating plane t dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 g 0.067 bsc 1.702 bsc h 0.087 0.112 2.210 2.845 j 0.015 0.025 0.381 0.635 k 1.020 1.065 25.908 27.051 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 u 0.105 0.117 2.667 2.972 s 0.543 0.582 13.792 14.783 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum.
135 motorola analog ic device data dp1, n, p, p1 suffix case 626-05 plastic package issue k n, p, n-14, p2 suffix case 646-06 plastic package issue l 14 1 dp2, n, p, pc suffix case 648-08 plastic package issue r 16 1 8 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 4. rounded corners optional. 17 14 8 b a f hg d k c n l j m seating plane dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.039 0.39 1.01 notes: 1. dimension l to center of lead when formed parallel. 2. package contour optional (round or square corners). 3. dimensioning and tolerancing per ansi y14.5m, 1982. 14 5 8 f note 2 a b t seating plane h j g d k n c l m m a m 0.13 (0.005) b m t dim min max min max inches millimeters a 9.40 10.16 0.370 0.400 b 6.10 6.60 0.240 0.260 c 3.94 4.45 0.155 0.175 d 0.38 0.51 0.015 0.020 f 1.02 1.78 0.040 0.070 g 2.54 bsc 0.100 bsc h 0.76 1.27 0.030 0.050 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 10 10 n 0.76 1.01 0.030 0.040
136 motorola analog ic device data b, p, p2, v suffix case 648c-03 plastic package (dip16) issue c 16 1 p suffix case 648e01 plastic package (dip16) issue o p suffix case 649-03 plastic package issue d 24 1 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. seating plane 1 12 24 13 j g f c k b h n q p a d m l dim min max min max inches millimeters a 31.50 32.13 1.240 1.265 b 13.21 13.72 0.520 0.540 c 4.70 5.21 0.185 0.205 d 0.38 0.51 0.015 0.020 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 14.99 15.49 0.590 0.610 m 10 10 n 0.51 1.02 0.020 0.040 p 0.13 0.38 0.005 0.015 q 0.51 0.76 0.020 0.030 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension a and b does not include mold protrusion. 5. mold flash or protrusions shall not exceed 0.25 (0.010). 6. rounded corner optional. a b 16 9 18 d g h s c 13 pl s b m 0.25 (0.010) t t seating plane j m l r p f k s a dim min max min max millimeters inches a 0.740 0.760 18.80 19.30 b 0.245 0.260 6.23 6.60 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.050 0.070 1.27 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.120 0.140 3.05 3.55 l 0.295 0.305 7.50 7.74 m 0 10 0 10 p 0.200 bsc 5.08 bsc r 0.300 bsc 7.62 bsc s 0.015 0.035 0.39 0.88 dim min max min max millimeters inches a 0.740 0.840 18.80 21.34 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 e 0.050 bsc 1.27 bsc f 0.040 0.70 1.02 1.78 g 0.100 bsc 2.54 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.040 0.39 1.01 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. internal lead connection between 4 and 5, 12 and 13. a b 16 9 18 f d g e n k c note 5 16 pl s a m 0.13 (0.005) t t seating plane s b m 0.13 (0.005) t j 16 pl m l 1 16
137 motorola analog ic device data a, b, n, p suffix case 707-02 plastic package issue c 18 1 p suffix case 710-02 plastic package issue b 28 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 15 14 28 m a b k c n f g d h j l dim min max min max inches millimeters a 36.45 37.21 1.435 1.465 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 10 9 18 m a b k c n f g d h j l dim min max min max inches millimeters a 22.22 23.24 0.875 0.915 b 6.10 6.60 0.240 0.260 c 3.56 4.57 0.140 0.180 d 0.36 0.56 0.014 0.022 f 1.27 1.78 0.050 0.070 g 2.54 bsc 0.100 bsc h 1.02 1.52 0.040 0.060 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 p suffix case 711-03 plastic package issue c 40 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 120 40 21 b a c seating plane d f g h k n m j l dim min max min max inches millimeters a 51.69 52.45 2.035 2.065 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040
138 motorola analog ic device data d, d1, d2 suffix case 751-05 plastic package (so-8, sop-8) issue r h, p, dp suffix case 738-03 plastic package issue e f, p, p-3 suffix case 724-03 plastic package (ndip24) issue d 24 1 notes: 1. chamfered contour optional. 2. dimension l to center of leads when formed parallel. 3. dimensioning and tolerancing per ansi y14.5m, 1982. 4. controlling dimension: inch. a b 24 13 12 1 t seating plane 24 pl k e f n c d g m a m 0.25 (0.010) t 24 pl j m b m 0.25 (0.010) t l m note 1 dim min max min max millimeters inches a 1.230 1.265 31.25 32.13 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.020 0.38 0.51 e 0.050 bsc 1.27 bsc f 0.040 0.060 1.02 1.52 g 0.100 bsc 2.54 bsc j 0.007 0.012 0.18 0.30 k 0.110 0.140 2.80 3.55 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension b does not include mold flash. m l j 20 pl m b m 0.25 (0.010) t dim min max min max millimeters inches a 25.66 27.17 1.010 1.070 b 6.10 6.60 0.240 0.260 c 3.81 4.57 0.150 0.180 d 0.39 0.55 0.015 0.022 g 2.54 bsc 0.100 bsc j 0.21 0.38 0.008 0.015 k 2.80 3.55 0.110 0.140 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.01 0.020 0.040 e 1.27 1.77 0.050 0.070 1 11 10 20 a seating plane k n f g d 20 pl t m a m 0.25 (0.010) t e b c f 1.27 bsc 0.050 bsc 8 1 seating plane 1 4 5 8 a 0.25 m cb ss 0.25 m b m h c x 45 l dim min max millimeters a 1.35 1.75 a1 0.10 0.25 b 0.35 0.49 c 0.18 0.25 d 4.80 5.00 e 1.27 bsc e 3.80 4.00 h 5.80 6.20 h 0 7 l 0.40 1.25 0.25 0.50 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. dimensions are in millimeters. 3. dimension d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include mold protrusion. allowable dambar protrusion shall be 0.127 total in excess of the b dimension at maximum material condition. d e h a b e b a1 c a 0.10
139 motorola analog ic device data d suffix case 751a-03 plastic package (so-14) issue f 14 1 d suffix case 751b-05 plastic package (so-16) issue j 16 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. a b g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t t f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p b a m 0.25 (0.010) b s t d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 dw, fp suffix case 751d-04 plastic package (so-20l, so20) issue e 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.150 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b 20 1 11 10 s a m 0.010 (0.25) b s t d 20x m b m 0.010 (0.25) p 10x j f g 18x k c t seating plane m r x 45 dim min max min max inches millimeters a 12.65 12.95 0.499 0.510 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029
1310 motorola analog ic device data dw suffix case 751e-04 plastic package (so-24l, sop (16+4+4)l) issue e 24 1 dw suffix case 751f-04 plastic package (so-28l, soic28) issue e 28 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 12x d 24x 12 13 24 1 m 0.010 (0.25) b m s a m 0.010 (0.25) b s t t g 22x seating plane k c r x 45 m f j dim min max min max inches millimeters a 15.25 15.54 0.601 0.612 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. j k f 1 15 14 28 a b 28x 14x d p s a m 0.010 (0.25) b s t m 0.010 (0.25) b m 26x g t seating plane c x 45 r m dim min max min max inches millimeters a 17.80 18.05 0.701 0.711 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.01 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 dw suffix case 751g-02 plastic package (so-16l, sop16l, sop-8+8l) issue a 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 8x g 14x d 16x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m c k
1311 motorola analog ic device data d suffix case 751k01 plastic package (so16) issue o 16 1 dw suffix case 751n01 plastic package (sop16l) issue o notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions a and b do not include mold protrusion. 4 maximum mold protrusion 0.15 (0.006) per side. 5 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. dim a min max min max inches 9.80 10.00 0.368 0.393 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 18 9 16 g p c k 14 x d seating plane j r m a b m 0.25 (0.010) b s f x 45 t s a m 0.25 (0.010) b s t 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p g 9x d 13x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m t s s 2.54 bsc 0.100 bsc t 3.81 bsc 0.150 bsc c k
1312 motorola analog ic device data case 762-01 plastic medium power package (sip-9) issue c 1 9 fn suffix case 775-02 plastic package (plcc-20) issue c 1 notes: 1. dimensioning and tolerancing per ansi y14.5, 1982. 2. controlling dimension: millimeter. 1 seating plane 9 u m a m 0.25 (0.010) t m a m 0.25 (0.010) t m c m 0.25 (0.010) t d 9 pl c a t e b k n m v s y r g f w q x j h dim min max min max inches millimeters a 22.40 23.00 0.873 0.897 b 6.40 6.60 0.252 0.260 c 3.45 3.65 0.135 1.143 d 0.40 0.55 0.015 0.021 e 9.35 9.60 0.368 0.377 f 1.40 1.60 0.055 0.062 g 2.54 bsc 0.100 bsc h 1.51 1.71 0.059 0.067 j 0.360 0.400 0.014 0.015 k 3.95 4.20 0.155 0.165 m 30 bsc 30 bsc n 2.50 2.70 0.099 0.106 q 3.15 3.45 0.124 0.135 r 13.60 13.90 0.535 0.547 s 1.65 1.95 0.064 0.076 u 22.00 22.20 0.866 0.874 v 0.55 0.75 0.021 0.029 w 2.89 bsc 0.113 bsc x 0.65 0.75 0.025 0.029 y 2.70 2.80 0.106 0.110 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). m n l y brk w v d d s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t x g1 b u z view dd 20 1 s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) t seating plane s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t h view s k k1 f g1 dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 1.02
1313 motorola analog ic device data fn suffix case 776-02 plastic package (plcc28) issue d 1 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). n m l v w d d y brk 28 1 view s s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t 0.004 (0.100) g1 g j c z r e a seating plane s lm m 0.007 (0.180) n s t t b s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t u s lm m 0.007 (0.180) n s t z g1 x view dd s lm m 0.007 (0.180) n s t k1 view s h k f s lm m 0.007 (0.180) n s t dim min max min max millimeters inches a 0.485 0.495 12.32 12.57 b 0.485 0.495 12.32 12.57 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.450 0.456 11.43 11.58 u 0.450 0.456 11.43 11.58 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.410 0.430 10.42 10.92 k1 0.040 1.02
1314 motorola analog ic device data fn suffix case 777-02 plastic package (plcc) issue c m suffix case 803c preliminary plastic package 1 1 20 n l m d y d k v w 1 44 brk b z u x view dd s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t g1 s lm s 0.010 (0.25) n s t k1 f h s lm m 0.007(0.180) n s t z g g1 r a e j view s c s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t 0.004 (0.10) t seating plane view s s lm s 0.010 (0.25) n s t s lm m 0.007(0.180) n s t notes: 1. datums l, m, and n are determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.25) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. dim min max min max millimeters inches a 0.685 0.695 17.40 17.65 b 0.685 0.695 17.40 17.65 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.650 0.656 16.51 16.66 u 0.650 0.656 16.51 16.66 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.610 0.630 15.50 16.00 k1 0.040 1.02 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim a min max min max inches 12.35 12.80 0.486 0.504 millimeters b 5.10 5.45 0.201 0.215 c 1.95 2.05 0.077 0.081 d 0.35 0.50 0.014 0.020 e 0.81 0.032 f 12.40* 0.488* g 1.15 1.39 0.045 0.055 h 0.59 0.81 0.023 0.032 j 0.18 0.27 0.007 0.011 k 1.10 1.50 0.043 0.059 l 0.05 0.20 0.001 0.008 m 0 10 n 0.50 0.85 0.020 0.033 s 7.40 8.20 0.291 0.323 0 10 notes: 6 dimensioning and tolerancing per ansi y14.5m, 1982. 7 controlling dimension: millimeter. 8 dimensions a and b do not include mold protrusion. 9 maximum mold protrusion 0.15 (0.008) per side. 10 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.006) total in excess of the d dimension at maximum material condition. *approximate a 0.13 (0.005) m tb ss 0.13 (0.005) m b m s 10 pl g d 20 pl l c 0.10 (0.004) seating plane k n j m e 1 20 11 10 a f b t
1315 motorola analog ic device data tv suffix case 821c-04 plastic package (15-pin zip) issue d 1 15 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.684 0.694 17.374 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.018 0.024 0.458 0.609 k 0.700 0.710 17.780 18.034 l 0.200 bsc 5.080 bsc m 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref y 0.625 0.639 15.875 16.231 b d u pin 15 15x g r a pin 1 m q p p m 0.010 (0.254) q s t j 15x m 0.024 (0.610) t k l h s v e c y t seating plane t suffix case 821d-03 plastic package issue c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. deleted 7. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.681 0.694 17.298 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 f g 0.050 bsc 1.270 bsc h 0.110 bsc 0.407 0.584 j 0.018 0.024 0.458 0.609 k q 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 u 0.110 bsc 2.794 bsc y 0.503 ref 12.776 ref b d u pin 15 15x g r a pin 1 q l p p m 0.010 (0.254) l s t j 15x m 0.024 (0.610) t k h e c y t seating plane f 7x 0.016 0.023 1.078 1.086 2.794 bsc 27.382 27.584 1 15
1316 motorola analog ic device data ftb suffix case 824d01 plastic package (tqfp44) issue o 1 ???? ???? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 44 1 34 33 11 12 22 23 detail aa z t a s tu m 0.20 (0.008) z s ab 0.05 (0.002) tu s b v u m y e h c ab detail ad 0.10 (0.004) k w x view ad t, u, z f n section aeae j d base metal plating ae ae g 0.05 (0.002) z detail aa dim min max min max inches millimeters a 9.950 10.050 0.392 0.396 b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.300 0.450 0.012 0.018 e 1.350 1.450 0.053 0.057 f 0.300 0.400 0.012 0.016 g 0.800 bsc 0.031 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l 8.000 bsc 0.315 bsc m 12 ref 12 ref n 0.090 0.160 0.004 0.006 q 1 5 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref y 12 ref 12 ref l l s tu m 0.20 (0.008) z s ac s tu m 0.20 (0.008) z s ab s tu m 0.20 (0.008) z s ac ac q s tu m 0.20 (0.008) z s ac r
1317 motorola analog ic device data fb suffix case 824e02 plastic package (qfp) issue a ??? ??? 44 1 34 33 11 12 22 23 view y n l a s lm m 0.20 (0.008) n s h s lm m 0.20 (0.008) n s t 0.05 (0.002) lm s b v m t m y e w c h datum plane view p 0.01 (0.004) h datum plane r2 k a1 c1 view p dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.00 2.21 0.079 0.087 d 0.30 0.45 0.0118 0.0177 e 2.00 2.10 0.079 0.083 f 0.30 0.40 0.012 0.016 g 0.80 bsc 0.031 bsc j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 m 5 10 5 10 s 12.95 13.45 0.510 0.530 v 12.95 13.45 0.510 0.530 w 0.000 0.210 0.000 0.008 y 5 10 5 10 a1 0.450 ref 0.170 0.018 ref 0.007 b1 l, m, n s lm m 0.20 (0.008) n s t f b1 section j1j1 j d base metal g 40x r r1 r 1 2 plating 44 pl j1 j1 g c1 1.600 ref 0.063 ref r1 r2 5 10 5 10 1 2 0.130 0.005 0.130 0.300 0.005 0.012 0.130 0.300 0.005 0.012 0 7 0 7 pin 1 ident s lm m 0.20 (0.008) n s h 0.05 (0.002) n s lm m 0.20 (0.008) n s t view y 3 pl notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 1 44
1318 motorola analog ic device data fb suffix case 840f01 plastic package issue o ?? ?? ?? ?? 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s z 0.050 (0.002) 0.050 (0.002) tu z u t l detail aa l 1 64 49 48 16 33 17 32 a s b v 0.10 (0.004) ab e h c y m detail ad ac r detail ad w k x q j d n base section aeae f metal detail aa g ae ae p t, u, z notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ac. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010 ) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). dim a min max min max inches 9.950 10.050 0.392 0.396 millimeters b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l m n 0.090 0.160 0.004 0.006 p q 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w x y 1.000 ref 12 ref 0.200 ref 0.039 ref 0.008 ref 0.010 bsc 0.250 bsc 7.500 bsc 0.295 bsc 5 12 ref 5 12 ref 5 12 ref 5 5 1 5 5 5 5 1 64
1319 motorola analog ic device data dm suffix case 846a02 plastic package (micro8) issue c 1 s b m 0.08 (0.003) a s t dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 1.10 0.043 d 0.25 0.40 0.010 0.016 g 0.65 bsc 0.026 bsc h 0.05 0.15 0.002 0.006 j 0.13 0.23 0.005 0.009 k 4.75 5.05 0.187 0.199 l 0.40 0.70 0.016 0.028 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. b a d k g pin 1 id 8 pl 0.038 (0.0015) t seating plane c h j l 8
1320 motorola analog ic device data fb suffix case 848b-04 plastic package (tqfp52) issue c 1 52 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. detail a l 39 40 26 27 1 52 14 13 l a b v s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c d b v b s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c h 0.10 (0.004) c seating plane datum plane m g h e c m detail c u q x w k t r detail c dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.10 2.45 0.083 0.096 d 0.22 0.38 0.009 0.015 e 2.00 2.10 0.079 0.083 f 0.22 0.33 0.009 0.013 g 0.65 bsc 0.026 bsc h 0.25 0.010 j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 l 7.80 ref 0.307 ref m 5 10 5 10 n 0.13 0.17 0.005 0.007 q 0 7 0 7 r 0.13 0.30 0.005 0.012 s 12.95 13.45 0.510 0.530 t 0.13 0.005 u 0 0 v 12.95 13.45 0.510 0.530 w 0.35 0.45 0.014 0.018 x 1.6 ref 0.063 ref b b detail a a, b, d jn d f base metal section bb s ab m 0.02 (0.008) d s c
1321 motorola analog ic device data fb suffix case 848d03 plastic package issue c f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane -h-. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the lead width to exceed 0.46 (0.018). minimum space between protrusion and adjacent lead or protrusion 0.07 (0.003). ??? ??? view aa view aa 2 x r r1 ab ab view y section abab rotated 90 clockwise dim a min max min max inches 10.00 bsc 0.394 bsc millimeters a1 5.00 bsc 0.197 bsc b 10.00 bsc 0.394 bsc b1 5.00 bsc 0.197 bsc c 1.70 0.067 c1 0.05 0.20 0.002 0.008 c2 1.30 1.50 0.051 0.059 d 0.20 0.40 0.008 0.016 e 0.45 0.030 f 0.22 0.35 0.009 0.014 g 0.65 bsc 0.75 0.018 0.026 bsc j 0.07 0.20 0.003 0.008 k 0.50 ref 0.020 ref r1 0.08 0.20 0.003 0.008 s 12.00 bsc 0.472 bsc s1 6.00 bsc 0.236 bsc u 0.09 0.16 0.004 0.006 v 12.00 bsc 0.472 bsc v1 6.00 bsc 0.236 bsc w 0.20 ref 0.008 ref z 1.00 ref 0.039 ref c l x x=l, m, n 1 13 14 26 27 39 40 52 4x tips 4x n 0.20 (0.008) h lm n 0.20 (0.008) t lm 3x view y seating plane c 0.10 (0.004) t 4x q 3 4x q 2 s 0.05 (0.002) 0.25 (0.010) gage plane c2 c1 w k e z s lm m 0.13 (0.005) n s t plating base metal d j u b v b1 a s v1 a1 s1 l n m h t q 1 q g q 1 q q 3 q 2 07 12 513 07 0 0 ref 12 ref 13 5 52 1
1322 motorola analog ic device data b suffix case 85901 plastic package (sdip) issue o 56 1 a b t 56 29 128 seating plane j 56 pl d 56 pl s a m 0.25 (0.010) t n f g e s b m 0.25 (0.010) t k c h l m dim min max min max millimeters inches a 2.035 2.065 51.69 52.45 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 e 0.035 bsc 0.89 bsc f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010) b suffix case 85801 plastic package issue o a 121 42 22 b seating plane t s a m 0.25 (0.010) t s b m 0.25 (0.010) t l h m j 42 pl d 42 pl f g n k c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010). dim min max min max millimeters inches a 1.435 1.465 36.45 37.21 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 42 1
1323 motorola analog ic device data fb, ftb suffix case 873-01 plastic package (tqfp32) issue a 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. u b l detail a l a 32 25 24 16 17 18 9 v s ab m 0.20 (0.008) d s c s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c ab 0.05 (0.002) s ab m 0.20 (0.008) d s h d a s b c seating plane h datum plane m g detail c m h c e 0.01 (0.004) h datum plane t detail c r k q x detail a b b p a, b, d s ab m 0.20 (0.008) d s c j f n d section bb base metal view rotated 90 clockwise dim min max min max inches millimeters a 6.95 0.274 0.280 b 6.95 7.10 0.274 0.280 c 1.40 1.60 0.055 0.063 d 0.273 0.373 0.010 0.015 e 1.30 1.50 0.051 0.059 f 0.273 0.010 g 0.80 bsc 0.031 bsc h 0.20 0.008 j 0.119 0.197 0.005 0.008 k 0.33 0.57 0.013 0.022 l 5.6 ref 0.220 ref m 6 8 6 8 n 0.119 0.135 0.005 0.005 p 0.40 bsc 0.016 bsc q 5 10 5 10 r 0.15 0.25 0.006 0.010 s 8.85 9.15 0.348 0.360 t 0.15 0.25 0.006 0.010 u 5 11 5 11 v 8.85 9.15 0.348 0.360 x 1.00 ref 0.039 ref 7.10
1324 motorola analog ic device data t suffix case 894-03 plastic package (23-pin szip) issue b 1 23 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension at maximum material condition. dim a min max min max millimeters 0.684 0.694 17.374 17.627 inches b 1.183 1.193 30.048 30.302 c 0.175 0.179 4.445 4.547 d 0.026 0.031 0.660 0.787 e 0.058 0.062 1.473 1.574 f 0.165 0.175 4.191 4.445 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.014 0.020 0.356 0.508 k 0.625 0.639 15.875 16.231 l 0.770 0.790 19.558 20.066 m 0.148 0.152 3.760 3.861 n 0.148 0.152 3.760 3.861 p 0.390 bsc 9.906 bsc r 0.416 0.424 10.566 10.770 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref w 0.200 bsc 5.080 bsc y 0.700 0.710 17.780 18.034 pin 1 d n m a p l b f u r g pin 23 23x s q m 0.010 (0.254) n s t y k v h s e c w m 0.024 (0.610) t j 23x t seating plane
1325 motorola analog ic device data fta suffix case 93202 plastic package (tqfp48) issue d dim a min max min max inches 7.000 bsc 0.276 bsc millimeters a1 3.500 bsc 0.138 bsc b 7.000 bsc 0.276 bsc b1 3.500 bsc 0.138 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 basic 0.020 basic h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 basic 0.010 basic q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 9.000 bsc 0.354 bsc s1 4.500 bsc 0.177 bsc v 9.000 bsc 0.354 bsc v1 4.500 bsc 0.177 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. ??? ??? ??? a a1 t z 0.200 (0.008) ab tu u 4x z 0.200 (0.008) ac tu 4x b b1 1 12 13 24 25 36 37 48 z s1 s v v1 p ae ae t, u, z detail y detail y base metal n j f d s tu m 0.080 (0.003) z s ac section aeae ab ac ad g 0.080 (0.003) ac m top & bottom q w k x e c h 0.250 (0.010) gauge plane r 9 detail ad 48 1
1326 motorola analog ic device data d2t suffix case 93603 plastic package issue b d2t suffix case 936a02 plastic package (d 2 pak) issue a v u terminal 4 a 12 3 k f b j s h d g c m 0.010 (0.254) t e m l p n r t optional chamfer 5 ref a 123 k b s h d g c e m l p n r v u terminal 6 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 6. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 g 0.067 bsc 1.702 bsc h 0.539 0.579 13.691 14.707 k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r 5 ref s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 45 m 0.010 (0.254) t t optional chamfer 5 ref 5 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 4. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 f 0.051 ref 1.295 ref g 0.100 bsc 2.540 bsc h 0.539 0.579 13.691 14.707 j 0.125 max 3.175 max k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 1 2 3 1 5
1327 motorola analog ic device data dt, dtb suffix case 948e02 plastic package (tssop20) issue a dtb suffix case 948f01 plastic package (tssop16, tssop16l) issue o dim a min max min max inches 6.60 0.260 millimeters b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 1 10 11 20 pin 1 ident a b t 0.100 (0.004) c d g h section nn k k1 jj1 n n m f w seating plane v u s u m 0.10 (0.004) v s t 20x ref k l l/2 2x s u 0.15 (0.006) t detail e 0.25 (0.010) detail e 6.40 0.252 s u 0.15 (0.006) t ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 16x ref k n n notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. 1 20 1 16
1328 motorola analog ic device data dtb suffix case 948g01 plastic package (tssop14) issue o 1 14 dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 14x ref k n n
1329 motorola analog ic device data dtb suffix case 948h01 plastic package issue o dim min max min max inches millimeters a 7.70 7.90 0.303 0.311 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 13 24 12 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 24x ref k n n 1 24
1330 motorola analog ic device data dtb suffix case 948j01 plastic package (tssop8) issue o 1 8 ??? ??? dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 4 8 5 see detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 8x ref k n n m suffix case 96701 plastic package (eiaj20) issue o dim min max min max inches 2.05 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.18 0.27 0.007 0.011 12.35 12.80 0.486 0.504 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 0.81 0.032 a 1 h e q 1 l e 10 0 10 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4 terminal numbers are shown for reference only. 5 the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). h e a 1 l e q 1 c a z d e 20 110 11 b m 0.13 (0.005) e 0.10 (0.004) view p detail p m l a b c d e e l m z 1 20
1331 motorola analog ic device data ftb suffix case 97601 plastic package (tqfp20) issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.650 bsc 0.026 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 5 6 11 16 10 15 20 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z s tu s 0.080 (0.003) z s ac 1 20
1332 motorola analog ic device data fta suffix case 97701 plastic package issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 6 7 13 19 12 18 24 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z p s tu s 0.080 (0.003) z s ac 1 24
1333 motorola analog ic device data n suffix case 121201 plastic package (sot23) issue o 1 dim min max millimeters a1 0.00 0.10 a2 1.00 1.30 b 0.30 0.50 c 0.10 0.25 d 2.80 3.00 e 2.50 3.10 e1 1.50 1.80 e 0.95 bsc e1 1.90 bsc l l1 0.45 0.75 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. datum c is a seating plane. a 1 5 23 4 d e1 b l1 e e e1 c m 0.10 c s b s a b 5x a2 a1 s 0.05 c l 0.20 h suffix case 121301 plastic package (sot89) issue o 1 dim min max millimeters a2 1.40 1.60 b 0.37 0.57 b1 0.32 0.52 c 0.30 0.50 d 4.40 4.60 d1 1.50 1.70 e 4.25 e1 2.40 2.60 e 1.50 bsc e1 3.00 bsc l1 0.80 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerancing per asme y14.5m, 1994. 3. datum c is a seating plane. a d e1 b l1 e d1 e e1 c m 0.10 c s b s a m 0.10 c s b s a b b1 2x a2 c

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